The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Apr. 11, 2016
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Norimichi Onozaki, Nagaokakyo, JP;

Kaoru Tachibana, Nagaokakyo, JP;

Mitsuru Odahara, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01F 41/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 41/0233 (2013.01); H01F 41/041 (2013.01); H01F 2027/2809 (2013.01);
Abstract

An electronic component includes a multilayer body having a configuration, in which a plurality of insulator layers containing ferrite ceramic are stacked, and a coil having a configuration, in which a plurality of coil conductor layers containing Ag and being disposed on the insulator layers are connected to at least one via hole conductor penetrating the insulator layers in the stacking direction, and having a spiral shape spiraling in the stacking direction. A first pore area ratio of a side gap interposed between an outer circumferential edge of an annular track formed by stacking the plurality of coil conductor layers and an outer edge of the multilayer body, when viewed in the stacking direction, is 9.0% or more and 20.0% or less, and the second pore area ratio of a portion interposed between two coil conductor layers in the stacking direction is 8.0% or less.


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