The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Jul. 27, 2016
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Nicolas Bernard Grossier, Oreno di Vimercate, IT;

Lorenzo Guerrieri, Aosta, IT;

Giuseppe Livio Gobbato, Milan, IT;

Daniele Zerbini, Vimercate, IT;

Martina Cordoni, Riese Pio X, IT;

Pasqualina Fragneto, Burago di Molgora, IT;

Assignee:

STMICROELECTRONICS S.R.L., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/3177 (2006.01); G01R 31/317 (2006.01); H04B 3/54 (2006.01); H02J 13/00 (2006.01); H05B 37/02 (2006.01); G06F 11/30 (2006.01); G01R 31/28 (2006.01); G06F 11/36 (2006.01); G06F 11/24 (2006.01); G06F 1/26 (2006.01);
U.S. Cl.
CPC ...
G01R 31/31713 (2013.01); G01R 31/28 (2013.01); G01R 31/3177 (2013.01); G06F 1/26 (2013.01); G06F 11/24 (2013.01); G06F 11/3024 (2013.01); G06F 11/3062 (2013.01); G06F 11/364 (2013.01); G06F 11/3636 (2013.01); G06F 11/3648 (2013.01); G06F 11/3656 (2013.01); H02J 13/0089 (2013.01); H02J 13/0093 (2013.01); H02J 13/0096 (2013.01); H04B 3/54 (2013.01); H04B 3/542 (2013.01); H05B 37/0263 (2013.01); H04B 2203/5495 (2013.01);
Abstract

A semiconductor device, for example an integrated circuit such as a microcontroller (MCU) or a digital signal processor (DSP), includes a semiconductor die coupled with a power supply line, a debug module coupled with the semiconductor die to exchange semiconductor die debug command and data signals with the semiconductor die, and a modem coupled with the power supply line. The debug module is arranged to convey the semiconductor die debug command and data signals over the power supply line.


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