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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10254184 B1

PDFFull Text
Date of Patent:
Apr. 09, 2019

Filed:

Oct. 03, 2014

Semiconductor pressure sensor

Applicant:

Fujikura Ltd., Tokyo, JP;

Inventors:

Naoki Takayama, Sakura, JP;

Michikazu Tomita, Sakura, JP;

Yuki Suto, Sakura, JP;

Satoshi Okude, Sakura, JP;

Assignee:

FUJIKURA LTD., Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Nguyen Q Ha

Int. Cl.
CPC ...
G01L 19/04 (2006.01); G01L 19/14 (2006.01); G01L 9/00 (2006.01); G01L 9/02 (2006.01); G01L 19/00 (2006.01); G01L 19/06 (2006.01); H01L 23/053 (2006.01); H01L 23/16 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0042 (2013.01); G01L 9/0051 (2013.01); G01L 9/025 (2013.01); G01L 19/0069 (2013.01); G01L 19/0092 (2013.01); G01L 19/04 (2013.01); G01L 19/0654 (2013.01); G01L 19/145 (2013.01); H01L 23/053 (2013.01); H01L 23/16 (2013.01); H01L 23/4952 (2013.01); H01L 23/49558 (2013.01); H01L 23/49575 (2013.01); H01L 23/49861 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/152 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract

A semiconductor pressure sensor of the invention, includes: a base body () including: a lead frame () having a first surface and a second surface; and a support () that supports the lead frame () and is made of a resin; a pressure sensor chip () provided on the first surface of the lead frame (); and a controller () that is provided on the second surface of the lead frame (), is implanted in the support (), is formed in the shape having a plurality of surfaces, includes a stress relief layer () that is formed on at least one of the plurality of surfaces and has a Young's modulus lower than that of the support (), and receives a sensor signal output from the pressure sensor chip () aid thereby outputs a pressure detection, the pressure sensor chip () at least partially overlapping the controller () in plan view.

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