The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Dec. 22, 2011
Jun-ichi Kumagai, Aizuwakamatsu, JP;
Yoshio Abe, Aizuwakamatsu, JP;
Akira Saito, Aizuwakamatsu, JP;
Shuzo Umezu, Aizuwakamatsu, JP;
Ryo Iino, Aizuwakamatsu, JP;
Jun-Ichi Kumagai, Aizuwakamatsu, JP;
Yoshio Abe, Aizuwakamatsu, JP;
Akira Saito, Aizuwakamatsu, JP;
Shuzo Umezu, Aizuwakamatsu, JP;
Ryo Iino, Aizuwakamatsu, JP;
Mitsubishi Shindoh Co., Ltd., Shinagawa-Ku, JP;
Abstract
A Cu—Ni—Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm, and the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm, a/b is in a range of 0.5 to 1.5.