The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Oct. 27, 2015
Applicant:
Tdk Corporation, Minato-ku, JP;
Inventors:
Tsutomu Yasui, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 19/03 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); C22C 13/02 (2006.01); C22C 1/04 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
C22C 19/03 (2013.01); B23K 35/262 (2013.01); B23K 35/3033 (2013.01); C22C 1/0433 (2013.01); C22C 1/0483 (2013.01); C22C 13/02 (2013.01); H05K 3/3463 (2013.01);
Abstract
An electronic circuit module component includes: an electronic component; a circuit board including the electronic component mounted thereon; and a bonding metal disposed between a terminal electrode of the electronic component and a terminal electrode of the circuit board, and including Sn alloy phases, an Ni—Sn alloy phase that disperses and forms between the Sn alloy phases and includes at least Fe, and a plurality of holes that is formed inside the Ni—Sn alloy phase and has a diameter of 5 μm or less. A center distance between the holes adjacent to each other is 10 μm or more.