The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Dec. 06, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Joseph Kuczynski, North Port, FL (US);
Kevin M. O'Connell, Rochester, MN (US);
Chelsie M. Peterson, Dexter, MN (US);
Mark D. Plucinski, Toms River, NJ (US);
Timothy J. Tofil, Rochester, MN (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/22 (2006.01); H01L 23/373 (2006.01); C09K 5/14 (2006.01); C08K 7/06 (2006.01);
U.S. Cl.
CPC ...
C08K 3/22 (2013.01); C08K 7/06 (2013.01); C09K 5/14 (2013.01); H01L 23/3733 (2013.01); C08K 2201/001 (2013.01);
Abstract
Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.