The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Sep. 30, 2015
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Assignee:
TORAY INDUSTRIES, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 27/26 (2006.01); B32B 27/04 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08G 59/32 (2006.01); C08G 59/38 (2006.01); C08G 59/50 (2006.01); C08J 5/04 (2006.01); C08G 59/24 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/042 (2013.01); C08G 59/245 (2013.01); C08G 59/3227 (2013.01); C08G 59/38 (2013.01); C08G 59/504 (2013.01); C08G 59/5026 (2013.01); C08G 59/5033 (2013.01); C08J 5/04 (2013.01); C08J 5/24 (2013.01); C08J 2363/00 (2013.01); C08J 2363/02 (2013.01);
Abstract
An epoxy resin composition is provided including at least the following component [A], component [B], and component [C] or [D] wherein cured product obtained by curing the epoxy resin composition has a rubbery state modulus in dynamic viscoelasticity evaluation of 10 MPa or less, and the cured product has a glass transition temperature of at least 95° C.;