Addition-curable silicone resin composition and a semiconductor device

Abstract

One of the purposes of the present invention is to provide an addition-curable silicone composition which provides a cured product having good performance at a low temperature and excellent resistance to a temperature change, and to provide a semiconductor device having a high reliability, whose semiconductor element is encapsulated with a product obtained by curing the addition-curable silicone composition. Thus, an addition-curable silicone resin composition comprising (A) a branched organopolysiloxane represented by the following formula (1): wherein a is an integer of from 2 to 100, b is an integer of from 5 to 100, c is an integer of from 5 to 100, 0.03≤a/(a+b)<1.0, and a ratio of the number of (RRSiO) unit to the number of (RSiO) unit is 2 or less; (B) an organopolysiloxane represented by the following formula (2): (RSiO)(RSiO)(RSiO)(SiO)(2) in an amount of 5 to 900 parts by mass, relative to 100 parts by mass of component (A); (C) an organopolysiloxane having at least two hydrosilyl groups, in an amount such that a ratio of the number of the hydrosilyl groups in component (C) to the number of the alkenyl groups in components (A) and (B) is 0.4 to 4.0; and (D) a hydrosilylation catalyst in an amount sufficient to accelerate hydrosilylation.