The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Feb. 24, 2015
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Mika Okumura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); G01P 15/125 (2006.01); G01P 15/18 (2013.01); B81C 1/00 (2006.01); G01P 15/08 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0051 (2013.01); B81C 1/00825 (2013.01); G01P 15/0802 (2013.01); G01P 15/125 (2013.01); G01P 15/18 (2013.01); B81B 2201/0235 (2013.01); B81B 2203/0118 (2013.01); B81C 2201/013 (2013.01); B81C 2201/0109 (2013.01); G01P 2015/082 (2013.01); G01P 2015/084 (2013.01); G01P 2015/0871 (2013.01);
Abstract

A semiconductor device includes a substrate, a beam, a movable structural body, a first stopper member, a second stopper member and a third stopper member. The first stopper member is arranged with a first gap from the movable structural body in an in-plane direction. The second stopper member is arranged with a second gap from the movable structural body in an out-of-plane direction. The third stopper member is arranged opposite to the second stopper member with the movable structural body interposed therebetween in the out-of-plane direction, and is arranged with a third gap from the movable structural body. Consequently, there can be provided a semiconductor device in which excessive displacement of the movable structural body can be suppressed to thereby suppress damage to and breakage of the beam supporting the movable structural body, and a method of manufacturing the same.


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Okumura, Mika. (2019). Semiconductor device and method of manufacturing the same (U.S. Patent No. 10252905). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10252905

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