The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Mar. 22, 2017
Applicant:

Shimano Inc., Sakai, Osaka, JP;

Inventors:

Toru Iwai, Osaka, JP;

Yoshikazu Kashimoto, Osaka, JP;

Assignee:

Shimano Inc., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60B 21/08 (2006.01); B60B 5/02 (2006.01); B60B 1/00 (2006.01); B60B 21/02 (2006.01); B60B 21/12 (2006.01);
U.S. Cl.
CPC ...
B60B 21/08 (2013.01); B60B 5/02 (2013.01); B05D 2201/00 (2013.01); B05D 2256/00 (2013.01); B05D 2502/00 (2013.01); B05D 2504/00 (2013.01); B60B 1/003 (2013.01); B60B 21/025 (2013.01); B60B 21/12 (2013.01); B60B 2310/234 (2013.01); B60B 2360/10 (2013.01); B60B 2360/30 (2013.01); B60B 2360/3412 (2013.01); B60B 2360/50 (2013.01); B60B 2900/572 (2013.01);
Abstract

A bicycle rim basically includes a first annular side surface portion, a second annular side surface portion, an annular connecting portion and an outermost layer. The first annular side surface portion includes a first braking surface. The second annular side surface portion includes a second braking surface. The epoxy resin layer is an example of a nonmetallic layer. The annular connecting portion connects the first and second annular side surface portions. The soft additive granules are disposed in at least one of the first and second annular side surface portions. The epoxy resin layer is disposed in at least one of the first and second annular side surface portions. The soft additive granules are at least partially embedded in the epoxy resin layer. The outermost layer covers the epoxy resin layer and the soft additive granules.


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