The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Mar. 17, 2016
Jasmin Berger, Dortmund, DE;
Rainer Goering, Borken, DE;
Klaus Gahlmann, Marl, DE;
Michael Boeer, Olfen, DE;
Mario Resing, Stadtlohn, DE;
Jasmin Berger, Dortmund, DE;
Rainer Goering, Borken, DE;
Klaus Gahlmann, Marl, DE;
Michael Boeer, Olfen, DE;
Mario Resing, Stadtlohn, DE;
Evonik Degussa GmbH, Essen, DE;
Abstract
A multilayer composite containing the following layers: I. a first layer (layer I) of a molding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; II. a second layer (layer II) of a molding compound containing at least 60 wt. % of EVOH; III. a third layer of a polyamide molding compound, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.