The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Mar. 13, 2018
Applicant:
Toshiba Kikai Kabushiki Kaisha, Chiyoda-ku, Tokyo-to, JP;
Inventors:
Isao Matsuzuki, Numazu, JP;
Yoshihiro Yamamoto, Numazu, JP;
Ryuji Tanaka, Gifu, JP;
Yu Murofushi, Numazu, JP;
Assignee:
Toshiba Kikai Kabushiki Kaisha, Tokyo-to, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/36 (2006.01); B29C 33/02 (2006.01); B29C 43/06 (2006.01); C03B 11/12 (2006.01); B29C 43/08 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 33/36 (2013.01); B29C 33/02 (2013.01); B29C 43/06 (2013.01); B29C 43/08 (2013.01); C03B 11/122 (2013.01); C03B 11/125 (2013.01); B29L 2031/00 (2013.01); C03B 2215/06 (2013.01); C03B 2215/66 (2013.01); C03B 2215/86 (2013.01); Y02P 40/57 (2015.11);
Abstract
A shape forming system according to one embodiment includes a mold assemblies; a heating unit; a pressing unit; a cooling unit; an isolation chamber configured to accommodate therein the heating unit, the pressing unit, and the cooling unit arranged in parallel with each other; and a conveyance unit configured to move the plurality of mold assemblies each of which is arranged on a plate provided in each of the heating unit, the pressing unit, and the cooling unit to thereby convey the mold assemblies in sequence.