The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Mar. 31, 2015
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Duy K. Lehuu, Lake Elmo, MN (US);

Kenneth A. P. Meyer, White Bear Township, MN (US);

Moses M. David, Woodbury, MN (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/22 (2006.01); B24B 37/22 (2012.01); B24B 37/26 (2012.01); B24B 37/24 (2012.01); B24B 7/24 (2006.01);
U.S. Cl.
CPC ...
B24B 37/26 (2013.01); B24B 7/228 (2013.01); B24B 7/241 (2013.01); B24B 37/22 (2013.01); B24B 37/24 (2013.01); B24B 37/245 (2013.01);
Abstract

The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes at least one of a plurality of precisely shaped pores and a plurality of precisely shaped asperities. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.


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