The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Oct. 30, 2017
Applicant:
Conti Temic Microelectronic Gmbh, Nürnberg, DE;
Inventors:
Assignee:
Conti Temic microelectronic GmbH, Nürnberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0278 (2013.01); H05K 1/141 (2013.01); H05K 3/0044 (2013.01); H05K 3/284 (2013.01); H05K 3/303 (2013.01); H05K 3/366 (2013.01); H05K 5/0082 (2013.01); H05K 2201/09045 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01); H05K 2203/302 (2013.01);
Abstract
The disclosure relates to a printed circuit board for an electronic component. The printed circuit board includes: an electrically insulating substrate; a number of electrically conductive conductor tracks; and at least one sensor dome having a sensor head and having a carrier body for accommodating the sensor head. The carrier body is formed integrally with the substrate. The disclosure also relates to a method for producing the printed circuit board.