The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Sep. 15, 2016
Applicant:
Innovium, Inc., San Jose, CA (US);
Inventor:
Yongming Xiong, Fremont, CA (US);
Assignee:
Innovium, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/0228 (2013.01); H05K 1/0245 (2013.01); H05K 1/0251 (2013.01); H05K 3/4038 (2013.01); H05K 1/181 (2013.01); H05K 3/0047 (2013.01); H05K 2201/09636 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/10545 (2013.01); H05K 2203/0207 (2013.01);
Abstract
A printed circuit board having multiple layers of circuitry, the printed circuit board including a first layer having a first cylindrical opening with a first diameter, the first cylindrical opening formed through at least the first layer and formed about a particular axis; and a second layer having a second cylindrical opening with a second diameter, the second cylindrical opening formed through at least the second layer and formed about the particular axis, where the first cylindrical opening is a portion of a conductive via, and where the second diameter is smaller than the first diameter.