The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Jul. 20, 2017
Applicant:

Primax Electronics Ltd., Taipei, TW;

Inventors:

Bo-An Chen, Taipei, TW;

Hsien-Tsan Chang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/24 (2006.01); H05K 3/18 (2006.01); C25D 17/00 (2006.01); C25D 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); C25D 17/002 (2013.01); H05K 1/0277 (2013.01); H05K 1/0393 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 1/189 (2013.01); H05K 3/188 (2013.01); H05K 3/243 (2013.01); C25D 5/00 (2013.01);
Abstract

A membrane circuit structure with function expandability is provided. The membrane circuit structure includes a substrate, a lower circuit layer and a covering layer. The substrate includes a first region and at least one second region. The at least one second region is arranged near the first region. The lower circuit layer is printed on the first region. The lower circuit layer is made of a first conductive material. The covering layer is electroplated on a portion of a surface of the lower circuit layer. The covering layer is made of a second conductive material. At least one expansion line is welded on the corresponding second region, and electrically connected with the covering layer and a corresponding function-expanding unit.


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