The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Oct. 29, 2014
Applicant:

Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Kosuke Ikeda, Hanno, JP;

Yuji Morinaga, Hanno, JP;

Osamu Matsuzaki, Hanno, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/367 (2006.01); H05K 7/20 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/021 (2013.01); H01L 23/3672 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H05K 1/18 (2013.01); H05K 7/209 (2013.01); H01L 2924/0002 (2013.01); H05K 3/0061 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10189 (2013.01);
Abstract

The present invention provides a heat dissipating structure with high heat dissipation performance while reducing the electric resistance. A heat dissipating structure includes: a heat sink having a base portion, and a plurality of heat dissipating fins provided upright on a first surface of the base portion; a first heat generating component provided on a side of the first surface of the base portion while being in contact with at least one heat dissipating fin of the plurality of heat dissipating fins; a circuit board joined to a second surface, opposite to the first face, of the base portion while being electrically connected to the first heat generating component; a second heat generating component provided on the circuit board, the second heat generating component generating a smaller amount of heat than the first heat generating component; and a connector electrically connecting the first heat generating component and the second heat generating component. The connector has a first outlet into which a first connecting terminal on a side of the first heat generating component is insertable, and a second outlet into which a second connecting terminal on a side of the second heat generating component is insertable.


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