The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Sep. 06, 2016
Apple Inc., Cupertino, CA (US);
Yi Jiang, Cupertino, CA (US);
Jiangfeng Wu, Santa Clara, CA (US);
Lijun Zhang, San Jose, CA (US);
Siwen Yong, Santa Clara, CA (US);
Jiaxiao Niu, Shanghai, CN;
Mattia Pascolini, San Francisco, CA (US);
Jayesh Nath, Milpitas, CA (US);
Carlo Di Nallo, San Carlos, CA (US);
Zheyu Wang, Sunnyvale, CA (US);
Mario Martinis, Cupertino, CA (US);
Eduardo Jorge Da Costa Bras Lima, Sunnyvale, CA (US);
Steven P. Cardinali, Campbell, CA (US);
Rex Tyler Ehman, Santa Clara, CA (US);
James G. Horiuchi, Fremont, CA (US);
Trevor J. Ness, Palo Alto, CA (US);
Scott D. Morrison, Santa Cruz, CA (US);
Siddharth Nangia, San Francisco, CA (US);
Mushtaq A. Sarwar, San Jose, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
An electronic device may have a display cover layer mounted to a metal housing. Electrical component layers such as a display layer, touch sensor layer, and near-field communications antenna layer may be mounted under the display cover layer. An antenna feed may have a positive feed terminal coupled to the electrical component layers and a ground feed terminal coupled to the metal housing. The electrical component layers may serve as an antenna resonating element for an antenna. The antenna may cover cellular telephone bands and may receive satellite navigation system signals. A system-in-package device may be mounted to the metal housing. A flexible printed circuit may extend between the electrical component layers and the system-in-package device. A mounting bracket for the system-in-package device may be provided with electrical isolation to enhance antenna performance in bands such as a satellite navigation system band.