The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Sep. 28, 2016
Applicant:

Nxp B.v., Eindhoven, NL;

Inventors:
Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 19/003 (2006.01); H01L 23/00 (2006.01); H01L 29/861 (2006.01); H01L 27/06 (2006.01); G06F 21/75 (2013.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H03K 19/003 (2013.01); G06F 21/75 (2013.01); H01L 23/573 (2013.01); H01L 23/576 (2013.01); H01L 27/0647 (2013.01); H01L 29/0649 (2013.01); H01L 29/861 (2013.01); H01L 29/8611 (2013.01); H01L 29/8613 (2013.01);
Abstract

Embodiments of devices and method for detecting semiconductor substrate thickness are disclosed. In an embodiment, an IC device includes a semiconductor substrate, a charge emitter embedded in the semiconductor substrate and configured to produce an electrical charge in the semiconductor substrate and a charge sensor embedded in the semiconductor substrate and configured to generate a response signal in response to the electrical charge produced in the semiconductor substrate. The magnitude of the response signal depends on the thickness of the semiconductor substrate.


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