The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Feb. 21, 2017
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventor:

Giuseppe Scilla, Catania, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 3/011 (2006.01); G01L 1/00 (2006.01); G01R 17/12 (2006.01); H01L 23/34 (2006.01); G01B 7/16 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H03K 3/011 (2013.01); G01B 7/18 (2013.01); G01L 1/00 (2013.01); G01R 17/12 (2013.01); H01L 22/34 (2013.01); H01L 23/34 (2013.01);
Abstract

A semiconductor substrate includes a first portion and a second portion. The first portion of the substrate has a first deformation-stress sensor capable of supplying a first stress signal. The second portion of the substrate has a second deformation-stress sensor capable of supplying a second stress signal. The first stress signal and second stress signal are processed by a circuit to produce a compensation signal. The compensation signal is applied in feedback to one of the first and second stress signals to compensate for variations induced in said one of the first and second stress signals by stresses in the semiconductor substrate.


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