The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Mar. 07, 2017
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Tomoyuki Kurihara, Tokyo, JP;

Kazushige Hatakeyama, Tokyo, JP;

Takuma Kuroyanagi, Tokyo, JP;

Yohei Shimizu, Tokyo, JP;

Masahiro Sato, Tokyo, JP;

Naoki Kakita, Tokyo, JP;

Kazutaka Suzuki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 9/02 (2006.01); H03H 3/08 (2006.01); H03H 9/05 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1071 (2013.01); H03H 3/08 (2013.01); H03H 9/02984 (2013.01); H03H 9/0547 (2013.01); H03H 9/1014 (2013.01); H03H 9/1064 (2013.01); H03H 9/6483 (2013.01); H01L 2224/16225 (2013.01);
Abstract

An acoustic wave device includes: a first substrate including a support substrate and a piezoelectric substrate bonded on an upper surface of the support substrate, and including a first acoustic wave element located on an upper surface of the piezoelectric substrate; a ring-shaped metal layer located in a region that surrounds the first acoustic wave element and in which the piezoelectric substrate is removed, a second substrate flip-chip mounted on an upper surface of the first substrate and including a functional element located on a lower surface of the second substrate; and a metallic member located on an upper surface of the ring-shaped metal layer, surrounding the second substrate in plan view, not located between the first substrate and the second substrate, and sealing the first acoustic wave element and the functional element so that the first acoustic wave element and the functional element are located across an air gap.


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