The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Jun. 29, 2017
Applicant:

Amazon Technologies, Inc., Seattle, WA (US);

Inventors:

Akshay Mohan, Santa Clara, CA (US);

Jagan Vaidyanathan Rajagopalan, San Jose, CA (US);

Deepak Pai Hosadurga, Santa Clara, CA (US);

Assignee:

Amazon Technologies, Inc., Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/648 (2006.01); H01R 13/6591 (2011.01); H01R 13/6477 (2011.01); H01R 13/04 (2006.01); H01R 13/46 (2006.01); H01R 13/40 (2006.01); H01R 12/52 (2011.01); H01R 13/6461 (2011.01); H01R 24/00 (2011.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6591 (2013.01); H01R 12/52 (2013.01); H01R 13/04 (2013.01); H01R 13/40 (2013.01); H01R 13/46 (2013.01); H01R 13/6477 (2013.01); H01R 13/6461 (2013.01); H01R 23/005 (2013.01); H05K 1/0216 (2013.01);
Abstract

High-speed data connectors having a variety of different implementations to address unwanted electromagnetic radiation and interference are described. In some instances, resonant unit structures are added within the existing connector cavity that absorb and dampen unwanted electromagnetic radiation. In other instances, resonant unit structures are added to the exterior of the connector to reduce and eliminate surface currents that can occur on the solid metal shield of the connector. In these and other instances, the resonant unit structure can be formed from a stacked structure having a resonant structure arranged in close proximity to some of the connector pins to absorb unwanted radiation from those pins. The absorbed energy is transferred to ground through other components in the stack. In still other instances, various different materials are provided to replace the conventional plastic material that is used to keep the connector pins in place and in alignment. The different materials can absorb unwanted electromagnetic radiation, and can be selected to address particular frequency ranges.


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