The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Nov. 02, 2016
Applicant:

Sii Crystal Technology Inc., Chiba-shi, Chiba, JP;

Inventor:

Naoya Ichimura, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 17/00 (2006.01); H01L 41/27 (2013.01); H01L 41/293 (2013.01); H01L 41/297 (2013.01); H03H 3/02 (2006.01); H03H 9/10 (2006.01); H03H 9/21 (2006.01); H01L 41/332 (2013.01);
U.S. Cl.
CPC ...
H01L 41/27 (2013.01); H01L 41/293 (2013.01); H01L 41/297 (2013.01); H03H 3/02 (2013.01); H03H 9/1014 (2013.01); H03H 9/21 (2013.01); H01L 41/332 (2013.01); H03H 2003/026 (2013.01);
Abstract

There is provided a method of manufacturing a piezoelectric vibrator element capable of preventing the piezoelectric vibrator element from being damaged when segmentallizing the piezoelectric vibrator element. The method of manufacturing a piezoelectric vibrator element includes the steps of providing the wafer with the piezoelectric plate and a frame part adapted to support the piezoelectric plate via a connection part, providing a pair of excitation electrodes to the piezoelectric plate, and forming a pair of extending electrodes extending from the piezoelectric plate to the frame part through the connection part and electrically connected respectively to the pair of excitation electrodes, and segmentallizing the piezoelectric plate by cutting the connection part. In the step of providing the pair of excitation electrodes, the pair of extending electrodes are formed on a side surface of the connection part.


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