The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Oct. 11, 2016
Applicant:

Abb Schweiz Ag, Baden, CH;

Inventors:

Hendrik Ravener, Remigen, CH;

Tobias Wikström, Egliswil, CH;

Hermann Amstutz, Mellingen, CH;

Norbert Meier, Würenlingen, CH;

Assignee:

ABB Schweiz AG, Baden, CH;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/745 (2006.01); H01L 23/051 (2006.01); H01L 23/31 (2006.01); H01L 29/74 (2006.01); H01L 29/744 (2006.01); H01L 21/56 (2006.01); H01L 29/45 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/745 (2013.01); H01L 21/565 (2013.01); H01L 23/051 (2013.01); H01L 23/3185 (2013.01); H01L 29/45 (2013.01); H01L 29/66363 (2013.01); H01L 29/744 (2013.01); H01L 29/7416 (2013.01); H01L 29/7424 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present application relates to a turn-off power semiconductor device having a wafer with an active region and a termination region surrounding the active region, a rubber ring as an edge passivation for the wafer and a gate ring placed on a ring-shaped gate contact on the termination region for contacting the gate electrodes of a thyristor cell formed in the active region of the wafer. In the turn-off power semiconductor device, the outer circumferential surface of the gate ring is in contact with the rubber ring to define the inner border of the rubber ring. The area consumed by the ring-shaped gate contact on the termination or edge region can be minimized. The upper surface of the gate ring and the upper surface of the rubber ring form a continuous surface extending in a plane parallel to the first main side of the wafer.


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