The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Oct. 13, 2017
Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Takashi Nakayama, Nagano, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 27/146 (2006.01); H01L 27/14 (2006.01); H01L 23/00 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 24/02 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 27/14 (2013.01); H04N 5/2253 (2013.01); H04N 5/2257 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14153 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17517 (2013.01);
Abstract

An image pickup apparatus includes: an image pickup device including a light receiving surface, an opposite surface, and an inclined surface, and provided with light receiving surface electrodes formed on the light receiving surface; cover glass joined so as to cover the light receiving surface; and a wiring board including second bond electrodes, wherein back surfaces of the light receiving surface electrodes being exposed to an opposite surface side, extended wiring patterns extended from the respective back surfaces of the light receiving surface electrodes through the inclined surface to the opposite surface, each of the extended wiring patterns including a first bond electrode, and the first bond electrode and the second bond electrode being bonded through a bump.


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