The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Jun. 30, 2016
Applicant:

Juniper Networks, Inc., Sunnyvale, CA (US);

Inventors:

Valery Kugel, Mountain View, CA (US);

Bhavesh Patel, Fremont, CA (US);

Pradeep Sindhu, Los Altos Hills, CA (US);

Assignee:

Juniper Networks, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/4853 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/50 (2013.01); H05K 1/181 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/1713 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/2075 (2013.01); H01L 2924/2076 (2013.01); H01L 2924/20751 (2013.01); H01L 2924/20752 (2013.01); H01L 2924/20753 (2013.01); H01L 2924/20754 (2013.01); H01L 2924/20755 (2013.01); H01L 2924/20756 (2013.01); H01L 2924/20757 (2013.01); H01L 2924/20758 (2013.01); H01L 2924/20759 (2013.01); H05K 2201/10734 (2013.01);
Abstract

In some examples, a device includes at least two integrated circuits (ICs) and a first multi-chip module (MCM) substrate coupled to the at least two ICs, the first MCM substrate comprising a first ball grid array (BGA), wherein the first BGA comprises a first pitch indicative of a distance between balls of the first BGA. The device further includes a second MCM substrate coupled to the first MCM substrate with the first BGA, the second MCM substrate comprising a second BGA, wherein the second BGA comprises a second pitch indicative of a distance between balls of the second BGA, and wherein the second pitch is greater than the first pitch. The device further includes a printed circuit board (PCB) coupled to the second MCM substrate with the second BGA, wherein the first MCM substrate and the second MCM substrate comprise organic, non-silicon insulating material.


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