The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Apr. 28, 2017
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Akira Yajima, Hitachinaka, JP;

Yoshiaki Yamada, Hitachinaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/525 (2006.01); H01L 21/56 (2006.01); H01L 23/532 (2006.01); H01L 21/311 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/311 (2013.01); H01L 21/321 (2013.01); H01L 21/56 (2013.01); H01L 23/293 (2013.01); H01L 23/3157 (2013.01); H01L 23/3192 (2013.01); H01L 23/525 (2013.01); H01L 23/53295 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02333 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03914 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/10145 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/1182 (2013.01); H01L 2224/1191 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13021 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/1369 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13163 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13565 (2013.01); H01L 2224/13686 (2013.01); H01L 2224/16112 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/3512 (2013.01);
Abstract

The semiconductor device includes: a semiconductor substrate; a conductor layer formed over the semiconductor substrate and having an upper surface and a lower surface; a conductive pillar formed on the upper surface of the conductor layer and having an upper surface, a lower surface, and a sidewall; a protection film covering the upper surface of the conductor layer and having an opening which exposes the upper surface and the sidewall of the conductive pillar; and a protection film covering the sidewall of the conductive pillar. Then, in plan view, the opening of the protection film is wider than the upper surface of the conductive pillar and exposes an entire region of an upper surface of the conductive pillar.


Find Patent Forward Citations

Quick Actions:

Yajima, Akira. (2019). Semiconductor device including conductive layer and conductive pillar disposed on conductive layer and method of manufacturing the same (U.S. Patent No. 10249589). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10249589

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…