The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

May. 30, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventor:

Jim Shih-Chun Liang, Poughkeepsie, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/77 (2017.01); H01L 21/8234 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 21/265 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/77 (2013.01); H01L 21/02019 (2013.01); H01L 21/02118 (2013.01); H01L 21/2652 (2013.01); H01L 21/76816 (2013.01); H01L 21/823425 (2013.01); H01L 27/12 (2013.01); H01L 27/3253 (2013.01);
Abstract

The present disclosure provides a contact element of a semiconductor device structure, wherein an opening is formed in an insulating material layer, the insulating material layer being provided over a semiconductor substrate. Within a lower portion of the opening, a contact liner portion is formed, the contact liner portion covering a bottom of the opening and partially covering a lower sidewall portion of the lower portion of the opening such that an upper sidewall portion at an upper portion of the opening is exposed to further processing. An insulating liner portion is formed within the opening, the insulating liner portion covering the exposed upper sidewall portion. Furthermore, a contact liner is formed within the opening, the contact liner covering the contact liner portion in the insulating liner portion, and the opening is filled with a conductive material.


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