The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Sep. 18, 2015
Applicant:

Boe Technology Group Co., Ltd, Beijing, CN;

Inventors:

Lu Liu, Beijing, CN;

Ming Che Hsieh, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 27/32 (2006.01); H01L 27/12 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 27/1218 (2013.01); H01L 27/1266 (2013.01); H01L 51/003 (2013.01); H01L 51/0097 (2013.01); H01L 27/3244 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68381 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); Y02E 10/549 (2013.01);
Abstract

Methods for manufacturing a flexible display device are provided. A flexible substrate is provided and a first bonding pattern, which encloses a display area, is formed on the flexible substrate. A second bonding pattern is formed on a rigid substrate. The first and second bonding patterns are bonded together to provide a bonding pattern between the flexible substrate and the rigid substrate. At least one display device is formed on the display area of the flexible substrate. The bonding pattern is removed by a cutting process performed so as to separate the flexible substrate having the display device thereon from the rigid substrate.


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