The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Aug. 02, 2017
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Manabu Kondo, Matsumoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/34 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H03H 9/10 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4842 (2013.01); H01L 21/56 (2013.01); H01L 23/3185 (2013.01); H01L 23/345 (2013.01); H01L 23/49572 (2013.01); H03H 9/10 (2013.01); H01L 24/81 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/8192 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83102 (2013.01); Y10T 29/4913 (2015.01);
Abstract

An electronic device includes: an electronic component including an external connection terminal; and a lead frame (metal member) connected to the external connection terminal. The lead frame is disposed with a pad. The pad overlaps the external connection terminal in plan view, and at least a portion of the pad is located outside the external shape of the electronic component in plan view. The pad and the external connection terminal are connected by means of a conductive bonding member. The pad and the electronic component are bonded together with a resin. The resin extends to a region of the pad located outside the external shape of the electronic component in plan view.


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