The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Jan. 05, 2018
Applicant:

Greatbatch Ltd., Clarence, NY (US);

Inventors:

Keith W. Seitz, Clarence Center, NY (US);

Dallas J. Rensel, Sanborn, NY (US);

Brian P. Hohl, Clarence, NY (US);

Jonathan Calamel, Williamsville, NY (US);

Xiaohong Tang, Williamsville, NY (US);

Robert A. Stevenson, Canyon Country, CA (US);

Christine A. Frysz, Orchard Park, NY (US);

Thomas Marzano, East Amherst, NY (US);

Jason Woods, Carson City, NV (US);

Richard L. Brendel, Carson City, NV (US);

Assignee:

Greatbatch Ltd., Clarence, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/37 (2006.01); B23K 1/00 (2006.01); B23K 35/00 (2006.01); C04B 41/45 (2006.01); H01B 17/30 (2006.01); A61N 1/375 (2006.01); C04B 41/51 (2006.01); C04B 41/88 (2006.01); H01B 19/02 (2006.01); C04B 41/00 (2006.01); B23K 1/008 (2006.01); B23K 1/19 (2006.01); B23K 26/32 (2014.01); B23K 26/21 (2014.01); B22F 7/04 (2006.01); B23K 101/36 (2006.01); B23K 103/14 (2006.01);
U.S. Cl.
CPC ...
H01B 17/30 (2013.01); A61N 1/3754 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 26/21 (2015.10); B23K 26/32 (2013.01); C04B 41/0072 (2013.01); C04B 41/4578 (2013.01); C04B 41/5122 (2013.01); C04B 41/5177 (2013.01); C04B 41/5194 (2013.01); C04B 41/88 (2013.01); H01B 19/02 (2013.01); B22F 7/04 (2013.01); B23K 2101/36 (2018.08); B23K 2103/14 (2018.08);
Abstract

A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of: a) forming an alumina ceramic body in a green state, or, stacking upon one another discrete layers of alumina ceramic in a green state and pressing; b) forming at least one via hole straight through the alumina ceramic body; c) filling the at least one via hole with a ceramic reinforced metal composite paste; d) drying the alumina ceramic body and the ceramic reinforced metal composite paste; e) forming a second hole straight through the ceramic reinforced metal composite paste being smaller in diameter in comparison to the at least one via hole; f) filling the second hole with a substantially pure metal paste; g) sintering the alumina ceramic body, the ceramic reinforced metal composite paste and the metal paste; and h) hermetically sealing the feedthrough dielectric body to a ferrule.


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