The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Nov. 18, 2016
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventors:
Makoto Kitagawa, Boise, ID (US);
Tomohito Tsushima, Tokyo, JP;
Wataru Otsuka, Boise, ID (US);
Takafumi Kunihiro, Tokyo, JP;
Assignee:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 13/00 (2006.01); G11C 7/04 (2006.01);
U.S. Cl.
CPC ...
G11C 13/0026 (2013.01); G11C 7/04 (2013.01); G11C 13/0002 (2013.01); G11C 13/004 (2013.01); G11C 13/0011 (2013.01); G11C 13/0033 (2013.01); G11C 13/0061 (2013.01); G11C 2013/0054 (2013.01);
Abstract
An integrated circuit system, and a method of manufacture thereof, including: an integrated circuit die; a non-volatile memory cell in the integrated circuit die and having a bit line for reading a data condition state of the non-volatile memory cell; and a voltage clamp in the integrated circuit die, the voltage clamp having a semiconductor switch connected to the bit line for reducing voltage excursions on the bit line.