The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Mar. 07, 2018
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Takamitsu Kitamura, Yokohama, JP;

Masataka Watanabe, Yokohama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/225 (2006.01); H01S 5/026 (2006.01); G02F 1/025 (2006.01); H01S 5/12 (2006.01); H01S 5/227 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01S 5/042 (2006.01);
U.S. Cl.
CPC ...
G02F 1/2257 (2013.01); G02F 1/025 (2013.01); H01L 21/76826 (2013.01); H01L 21/76829 (2013.01); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01S 5/0265 (2013.01); H01S 5/0425 (2013.01); H01S 5/12 (2013.01); H01S 5/227 (2013.01);
Abstract

A semiconductor optical element is disclosed. The semiconductor optical element includes: a mesa-shaped optical waveguide formed on a substrate; a modulation electrode formed on the optical waveguide; a first resin layer that buries side surfaces of the optical waveguide; a bonding pad formed on the first resin layer; and a connecting wiring line that connects the modulation electrode and the bonding pad. In the semiconductor optical element, side surfaces of the bonding pad are partially covered with a second resin layer provided on the first resin layer, and the connecting wiring line extends on the second resin layer.


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