The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Jun. 30, 2016
Applicant:
Hitachi Automotive Systems, Ltd., Ibaraki, JP;
Inventors:
Hanae Shimokawa, Tokyo, JP;
Shosaku Ishihara, Tokyo, JP;
Atsuo Soma, Hitachinaka, JP;
Junji Onozuka, Hitachinaka, JP;
Hiroshi Onuki, Hitachinaka, JP;
Daisuke Terada, Hitachinaka, JP;
Mizuki Shibata, Hitachinaka, JP;
Assignee:
HITACHI AUTOMOTIVE SYSTEMS, LTD., Ibaraki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01C 8/02 (2006.01); G01L 9/00 (2006.01); G01B 7/16 (2006.01); H01L 29/84 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0055 (2013.01); G01B 7/16 (2013.01); G01B 7/18 (2013.01); G01L 9/00 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 29/84 (2013.01); H01L 2224/29019 (2013.01); H01L 2224/2957 (2013.01); H01L 2224/29288 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29552 (2013.01); H01L 2224/29575 (2013.01); H01L 2224/29688 (2013.01); H01L 2224/8389 (2013.01); H01L 2224/83192 (2013.01);
Abstract
A semiconductor device includes a metal body; a bonding layer placed on the metal body; and a semiconductor chip placed on the bonding layer. The bonding layer includes a filler-containing first layer formed between the metal body and the semiconductor chip and a second layer bonded to the first layer and the semiconductor chip. The second layer has a thermal expansion coefficient higher than that of the first layer.