The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Apr. 27, 2017
Continental Automotive Systems, Inc., Auburn Hills, MI (US);
Jen-Huang Albert Chiou, Libertyville, IL (US);
Continental Automotive Systems, Inc., Auburn Hills, MI (US);
Abstract
A MEMS pressure sensing element and integrated circuit (IC) are mounted on a circuit board. The sensing element and IC can be either stacked or unstacked. Bond wires connect the IC to the circuit board. Other bond wires connect the sensing element to the IC. A cap covers the sensing element and IC. The cap is attached to the circuit board and has a small hole in it, through which viscous gel is inserted. The gel encapsulates the MEMS sensing element, IC and bond wires in the cap. The hole also allows pressurized fluid to enter the cap and exert force on the MEMS pressure sensing element after encapsulation in the gel. Chip capacitors can also be mounted on the circuit board, outside the cap. Electrical signals are generated, which represent pressure applied to the MEMS pressure sensing element through the hole and gel.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile