The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Sep. 22, 2016
Applicant:

Withustech Co., Ltd., Daejeon, KR;

Inventors:

Soon-Gil Yoon, Daejeon, KR;

Byeong-Ju Park, Daejeon, KR;

Assignee:

Kuk-II Graphene Co., Ltd., Gangnam-gu, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/18 (2006.01); C23C 16/26 (2006.01); C23C 16/02 (2006.01); C23C 16/46 (2006.01); C23C 16/52 (2006.01); C23C 14/34 (2006.01); C23C 14/18 (2006.01); C23C 14/20 (2006.01); C03C 17/36 (2006.01); H01L 21/285 (2006.01); C30B 25/16 (2006.01); C30B 29/02 (2006.01);
U.S. Cl.
CPC ...
C30B 25/186 (2013.01); C03C 17/3634 (2013.01); C03C 17/3649 (2013.01); C23C 14/185 (2013.01); C23C 14/205 (2013.01); C23C 14/34 (2013.01); C23C 16/0281 (2013.01); C23C 16/26 (2013.01); C23C 16/46 (2013.01); C23C 16/52 (2013.01); C30B 25/165 (2013.01); C30B 29/02 (2013.01); H01L 21/28506 (2013.01);
Abstract

The present invention relates to a transfer-free method for forming a graphene layer, in which a high-quality graphene layer having excellent crystallinity can be easily formed over a large area at low temperature by a transfer-free process so that it can be applied directly to a base substrate, which is used in a transparent electrode, a semiconductor device or the like, without requiring a separate transfer process, and to an electrical device comprising a graphene layer formed by the method. More specifically, the transfer-free method for forming a graphene layer comprises the steps of: depositing a Ti layer having a thickness of 3-20 m on a base substrate by sputtering; and growing graphene on the deposited Ti layer by chemical vapor deposition.


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