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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10246620 B1

PDFFull Text
Date of Patent:
Apr. 02, 2019

Filed:

Mar. 26, 2015

Cmp polishing agent, method for manufacturing thereof, and method for polishing substrate

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventor:

Mitsuhito Takahashi, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Timothy V Eley

Int. Cl.
CPC ...
C09K 3/14 (2006.01); B24B 7/22 (2006.01); C09G 1/04 (2006.01); B24B 37/04 (2012.01); C01F 17/00 (2006.01); C09G 1/02 (2006.01); H01L 21/306 (2006.01); H01L 21/3105 (2006.01); B24B 37/00 (2012.01); B24B 37/20 (2012.01); B24B 37/10 (2012.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
C09K 3/1463 (2013.01); B24B 7/228 (2013.01); B24B 37/00 (2013.01); B24B 37/044 (2013.01); B24B 37/105 (2013.01); B24B 37/20 (2013.01); C01F 17/0043 (2013.01); C09G 1/02 (2013.01); C09G 1/04 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/76224 (2013.01); C01P 2004/62 (2013.01); C01P 2004/64 (2013.01);
Abstract

The present invention is a CMP polishing agent, including polishing particles, a protective film-forming agent, and water, wherein the protective film-forming agent is a copolymer of styrene and acrylonitrile, and an average molecular weight of the copolymer is 500 or more and 20000 or less. This provides a polishing agent which can polish an insulation film with few polishing scratches and has high polishing selectivity of an insulation film to a polishing stop film in a CMP step, a method for manufacturing the polishing agent, and a method for polishing a substrate by using the polishing agent.

Find Patent Forward Citations

Takahashi, Mitsuhito. (2019). Cmp polishing agent, method for manufacturing thereof, and method for polishing substrate (U.S. Patent No. 10246620). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10246620

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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