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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10246605 B1

PDFFull Text
Date of Patent:
Apr. 02, 2019

Filed:

Feb. 24, 2017

Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit, and process for producing device

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Tadashi Oomatsu, Haibara-gun, JP;

Hirotaka Kitagawa, Haibara-gun, JP;

Yuichiro Goto, Haibara-gun, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Robert C Boyle

Int. Cl.
CPC ...
C09D 5/00 (2006.01); C09D 151/00 (2006.01); B32B 27/00 (2006.01); C09D 133/14 (2006.01); C09D 201/02 (2006.01); B29C 59/00 (2006.01); B29C 59/16 (2006.01); G03F 7/00 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); C08F 290/14 (2006.01); C09D 151/08 (2006.01); G03F 7/075 (2006.01); G03F 7/09 (2006.01); C09D 7/40 (2018.01); C09D 5/32 (2006.01); C09D 7/65 (2018.01); B29C 59/02 (2006.01); B29K 33/00 (2006.01);
U.S. Cl.
CPC ...
C09D 151/003 (2013.01); B29C 59/005 (2013.01); B29C 59/16 (2013.01); B32B 27/00 (2013.01); C08F 290/142 (2013.01); C09D 5/00 (2013.01); C09D 5/32 (2013.01); C09D 7/40 (2018.01); C09D 7/65 (2018.01); C09D 133/14 (2013.01); C09D 151/08 (2013.01); C09D 201/02 (2013.01); G03F 7/0002 (2013.01); G03F 7/0752 (2013.01); G03F 7/094 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/02345 (2013.01); H01L 21/31058 (2013.01); B29C 59/02 (2013.01); B29K 2033/08 (2013.01); C08F 2438/02 (2013.01);
Abstract

Provided are a resin composition for underlayer film formation with which a variation hardly occurs in the line width distribution after processing due to a small thickness of a residual film after mold pressing, a layered product, a method for forming a pattern, an imprint forming kit, and a process for producing a device. Disclosed is a resin composition for underlayer film formation which is used to form an underlayer film by being applied onto a base material, including a first resin having a radical reactive group in the side chain, a second resin containing at least one selected from a fluorine atom and a silicon atom, and a solvent. The second resin is preferably a resin containing a fluorine atom. The radical reactive group of the first resin is preferably a (meth)acryloyl group.

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