The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Dec. 16, 2015
Applicant:
Hexcel Holding Gmbh, Pasching, AT;
Inventor:
Bernhard Neumayer, Pasching, AT;
Assignee:
HEXCEL HOLDING GMBH, Pasching, AT;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/10 (2006.01); C08G 59/40 (2006.01); B32B 5/02 (2006.01); A63C 5/12 (2006.01); C08J 5/04 (2006.01); C08J 5/24 (2006.01); C08K 3/36 (2006.01); B29B 11/16 (2006.01); B29K 63/00 (2006.01); B32B 15/20 (2006.01); C08G 59/24 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01); B32B 15/092 (2006.01);
U.S. Cl.
CPC ...
C08G 59/4021 (2013.01); B29B 11/16 (2013.01); B32B 5/022 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); C08G 59/245 (2013.01); C08G 59/686 (2013.01); C08J 5/043 (2013.01); C08J 5/10 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08L 63/00 (2013.01); A63C 5/12 (2013.01); B29K 2063/00 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); C08J 2363/00 (2013.01); C08J 2363/02 (2013.01); C08J 2463/10 (2013.01); C08L 2205/06 (2013.01);
Abstract
This invention relates to a composition comprising a semisolid epoxy resin containing a curative dispersed therein. The curative has a particle size such that at least 90% of the particles have a size below 25 pm at ambient temperature of 21° C., wherein the composition further comprises a diluent containing a particulate filler. The composition is used as matrix in prepregs. The use of the diluent increases peel strength of the composition when brought into contact with metal or wood substrate.