The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Aug. 19, 2015
Applicant:

Kuraray Co., Ltd., Kurashiki-shi, JP;

Inventors:

Wataru Hirose, Kurashiki, JP;

Takeyuki Igarashi, Okayama, JP;

Assignee:

KURARAY CO., LTD., Kurashiki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 53/00 (2006.01); C08L 29/04 (2006.01); C08F 216/06 (2006.01); B32B 27/28 (2006.01); C08J 5/18 (2006.01); C08F 210/02 (2006.01); C08F 210/10 (2006.01); C08F 297/08 (2006.01); B32B 27/30 (2006.01);
U.S. Cl.
CPC ...
C08F 216/06 (2013.01); B32B 27/28 (2013.01); B32B 27/306 (2013.01); C08F 210/02 (2013.01); C08F 210/10 (2013.01); C08F 297/08 (2013.01); C08J 5/18 (2013.01); C08L 29/04 (2013.01); C08L 53/00 (2013.01); C08L 2205/04 (2013.01);
Abstract

A resin composition according to an aspect of the present invention comprises: an ethylene-vinyl alcohol copolymer (A); and a block copolymer (B) having a block (b1) that includes a vinyl aromatic monomer unit, and a block (b2) that includes an isobutylene unit, wherein the ethylene-vinyl alcohol copolymer (A) and the block copolymer (B) form a co-continuous phase structure; and a DSC curve obtained following heating the resin composition up to a melting point and cooling at a rate of 50° C./min in a differential scanning calorimetry analysis shows two peaks, with a higher peak top temperature falling within a range of 130° C. or greater and 170° C. or less, and a lower peak top temperature falling within a range of 100° C. or greater and less than 130° C. A resin composition may thus be obtained that is able to give a molded article that is superior in balance between gas barrier properties and flexibility.


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