The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Sep. 07, 2017
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Masashi Yoshiike, Chino, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B41J 2/14 (2006.01); B81C 1/00 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B41J 2/14 (2013.01); B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1607 (2013.01); B41J 2/1621 (2013.01); B41J 2/1626 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B81C 1/00301 (2013.01); B41J 2002/14362 (2013.01); B41J 2002/14491 (2013.01); B81B 2201/052 (2013.01); B81B 2207/07 (2013.01); B81C 2201/013 (2013.01);
Abstract
There is provided a MEMS device including: a substrate having a resin portion that protrudes from one surface thereof and is made of a resin, in which the first wiring extends along a first direction on the one surface from a position overlapping the resin portion to a position deviating from the resin portion, and in which a width of the resin portion is equal to or larger than a width of the first wiring covering the resin portion in a second direction intersecting the first direction.