The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Oct. 04, 2017
Applicant:

Datamax-o'neil Corporation, Orlando, FL (US);

Inventors:

Eng Hing Lim, Singapore, SG;

Yaw Horng Yap, Singapore, SG;

Aravindkumar Harinarayanan, Singapore, SG;

Assignee:

DATAMAX-O'NEIL CORPORATION, Orlando, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/165 (2006.01); B41J 15/02 (2006.01); B41J 2/315 (2006.01);
U.S. Cl.
CPC ...
B41J 15/02 (2013.01); B41J 2/315 (2013.01);
Abstract

Printer spindle assembly is provided including media spindle having first end and second end, a commutator disposed circumferentially at first end, at least two brushes in electrical contact with commutator and connected to voltage source, a plurality of electrically conductive springs serially disposed on media spindle in electrical communication with commutator, and a continuous electrically conductive path formed of electrically resistive material disposed along longitudinal axis of media spindle and configured to be in electrical contact with first spring end of one or more electrically conductive springs in the compressed state to form series circuit. Voltage source, brushes, and commutator form closed electrical circuit. Each electrically conductive spring is configured to be in uncompressed state in absence of media on media spindle and one or more of electrically conductive springs is configured to be in compressed state in presence of media on media spindle.


Find Patent Forward Citations

Loading…