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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10245818 B1

PDFFull Text
Date of Patent:
Apr. 02, 2019

Filed:

Dec. 13, 2015

Method and arrangement for pre-curing an adhesive layer

Applicants:

Hyundai Motor Company, Seoul, KR;

Hyundai Motor Europe Technical Center Gmbh, Russelsheim, DE;

Kia Motors Corporation, Seoul, KR;

Inventors:

Andrew Vaughan, Mainz, DE;

Julien Richeton, Main, DE;

Assignees:

Hyundai Motor Company, Seoul, KR;

Hyundai Motor Europe Technical Center GmbH, Russelsheim, DE;

Kia Motors Corporation, Seoul, KR;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Primary Examiner:

Rachel Kahn

Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 7/12 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01); B32B 37/06 (2006.01); B32B 15/092 (2006.01); B32B 15/095 (2006.01); B32B 5/02 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/14 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 27/06 (2006.01);
U.S. Cl.
CPC ...
B32B 37/12 (2013.01); B32B 5/02 (2013.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B32B 15/043 (2013.01); B32B 15/08 (2013.01); B32B 15/092 (2013.01); B32B 15/095 (2013.01); B32B 15/14 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/06 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); B32B 37/06 (2013.01); B32B 2250/02 (2013.01); B32B 2260/021 (2013.01); B32B 2260/04 (2013.01); B32B 2307/202 (2013.01); B32B 2307/542 (2013.01); B32B 2309/02 (2013.01); B32B 2309/04 (2013.01); B32B 2310/022 (2013.01); B32B 2363/00 (2013.01); B32B 2375/00 (2013.01); B32B 2605/00 (2013.01);
Abstract

The invention provides a method for pre-curing an adhesive layer bonding a first component to a second component. The adhesive layer is heated by treating an adhesive layer component as heating the first component with a pair of electrodes that are in electrical contact with a surface of the first component, the pair of electrodes applying a predetermined electrical current (I, I) to the first component. The invention further provides an arrangement for pre-curing a layer of adhesive.

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