The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Sep. 21, 2017
Apple Inc., Cupertino, CA (US);
Daniel W. Jarvis, Sunnyvale, CA (US);
David A. Pakula, San Francisco, CA (US);
David J. Dunsmoor, San Jose, CA (US);
Ian A. Spraggs, San Francisco, CA (US);
Lee E. Hooton, Ridge, NY (US);
Marwan Rammah, San Francisco, CA (US);
Matthew D. Hill, Santa Clara, CA (US);
Robert F. Meyer, Palo Alto, CA (US);
James A. Bertin, San Jose, CA (US);
Eric M. Bennett, Foster City, CA (US);
Simon C. Helmore, San Francisco, CA (US);
Melissa A. Wah, San Jose, CA (US);
Jon F. Housour, Sunnyvale, CA (US);
Douglas G. Fournier, San Jose, CA (US);
Christopher S. Tomasetta, Sunnyvale, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.