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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10244639 B1

PDFFull Text
Date of Patent:
Mar. 26, 2019

Filed:

Nov. 05, 2012

Method of manufacturing stacked mounting structure

Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Mikio Nakamura, Hinodemachi, JP;

Yu Kondo, Yamato, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:

Scully, Scott, Murphy & Presser, P.C.

Primary Examiner:

Livius Radu Cazan

Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 3/46 (2006.01); H05K 3/40 (2006.01); H05K 3/36 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 3/368 (2013.01); H01L 24/19 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H05K 1/144 (2013.01); H05K 3/4046 (2013.01); H05K 3/4647 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/274 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/01079 (2013.01); H05K 3/284 (2013.01); H05K 3/3426 (2013.01); H05K 3/3436 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10242 (2013.01); H05K 2201/10318 (2013.01); H05K 2203/025 (2013.01); H05K 2203/1316 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49117 (2015.01); Y10T 29/49147 (2015.01);
Abstract

A stacked mounting structure and a method of manufacturing stacked mounting structure are provided. The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.

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