logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10244635 B1

PDFFull Text
Date of Patent:
Mar. 26, 2019

Filed:

Jan. 31, 2017

Production method for copper-clad laminate plate

Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Ayumu Tateoka, Ageo, JP;

Makoto Hosokawa, Ageo, JP;

Shota Kawaguchi, Ageo, JP;

Assignee:

MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Mark A Osele

Assistant Examiner:

Nickolas R Harm

Int. Cl.
CPC ...
B29C 65/00 (2006.01); H05K 3/02 (2006.01); B32B 15/08 (2006.01); C23C 22/63 (2006.01); B32B 7/12 (2006.01); B32B 15/085 (2006.01); B32B 27/32 (2006.01); B32B 37/14 (2006.01); H05K 3/38 (2006.01); C23C 22/52 (2006.01); B32B 38/00 (2006.01); C25D 1/04 (2006.01); B32B 15/20 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/022 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/085 (2013.01); B32B 27/322 (2013.01); B32B 37/144 (2013.01); B32B 38/0012 (2013.01); C23C 22/52 (2013.01); C23C 22/63 (2013.01); C25D 1/04 (2013.01); H05K 3/385 (2013.01); H05K 3/389 (2013.01); B29C 66/45 (2013.01); B29C 66/472 (2013.01); B29C 66/7352 (2013.01); B29C 66/7392 (2013.01); B32B 15/20 (2013.01); B32B 2255/24 (2013.01); B32B 2309/105 (2013.01); B32B 2327/18 (2013.01); B32B 2398/20 (2013.01); B32B 2457/08 (2013.01); C25D 3/38 (2013.01); H05K 2203/0307 (2013.01);
Abstract

There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

Find Patent Forward Citations

Loading…