The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Aug. 21, 2015
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
Tai Anh Lam, Renton, WA (US);
Jean Ann Nielsen, Kent, WA (US);
Minas H. Tanielian, Bellevue, WA (US);
Assignee:
THE BOEING COMPANY, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/141 (2013.01); H05K 2201/041 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10166 (2013.01);
Abstract
A microwave device can include a printed circuit board substrate having a first microwave device subcircuit and a microdevice substrate having a second microwave device subcircuit. The first microwave device subcircuit may be formed at a low resolution and a low tolerance, while the second microwave device subcircuit may be formed at a high resolution and a high tolerance. The first microwave device subcircuit and the second microwave device subcircuit may be electrically coupled using a conductor.