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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10244626 B1

PDFFull Text
Date of Patent:
Mar. 26, 2019

Filed:

Sep. 08, 2014

Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring board

Applicants:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Sumitomo Electric Printed Circuits, Inc., Koka-shi, Shiga, JP;

Inventors:

Takayuki Yonezawa, Osaka, JP;

Shingo Kaimori, Osaka, JP;

Jun Sugawara, Osaka, JP;

Shogo Asai, Shiga, JP;

Yoshifumi Uchita, Shiga, JP;

Masaya Kakimoto, Shiga, JP;

Assignees:

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;

SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka-shi, Shiga, JP;

Attorney:

Drinker Biddle & Reath LLP

Primary Examiner:

Seth Dumbris

Int. Cl.
CPC ...
B32B 15/08 (2006.01); H05K 1/05 (2006.01); C09J 179/08 (2006.01); C08G 73/10 (2006.01); C08G 77/455 (2006.01); C09J 183/10 (2006.01); C08L 63/00 (2006.01); B32B 7/12 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/38 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01); C08K 3/34 (2006.01); C09J 7/10 (2018.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); B32B 27/38 (2013.01); C08G 73/105 (2013.01); C08G 73/106 (2013.01); C08G 73/1042 (2013.01); C08G 73/1082 (2013.01); C08G 77/455 (2013.01); C08K 3/34 (2013.01); C08L 63/00 (2013.01); C09J 7/10 (2018.01); C09J 179/08 (2013.01); C09J 183/10 (2013.01); H05K 3/386 (2013.01); H05K 3/4673 (2013.01); B32B 2264/10 (2013.01); B32B 2307/202 (2013.01); B32B 2307/306 (2013.01); B32B 2307/7265 (2013.01); B32B 2457/08 (2013.01); C09J 2463/00 (2013.01); C09J 2479/08 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0162 (2013.01);
Abstract

An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.75 or less, and n is 0.25 or more and 0.65 or less. Rin formula (1) represents a divalent diamine siloxane residue, and Rin formula (2) represents a divalent aromatic diamine residue.

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