The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Oct. 06, 2016
Applicant:

Toyoda Gosei Co., Ltd., Kiyosu-shi, JP;

Inventor:

Yuhki Ito, Kiyosu, JP;

Assignee:

TOYODA GOSEI CO., LTD., Kiyosu-Shi, Aichi-Ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/52 (2010.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/483 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A method of manufacturing a light-emitting device includes providing a resin sheet that includes a lattice-patterned reflective material-containing portion and film-shaped phosphor-containing portions covering lattice openings of the reflective material-containing portion, placing the resin sheet on a substrate mounting a plurality of light-emitting elements such that each of the plurality of light-emitting elements is surrounded by the reflective material-containing portion and is covered on the top with the phosphor-containing portion, after placing the resin sheet on the substrate, softening the resin sheet by heating such that the phosphor-containing portions are adhered to the respective upper surfaces of the plurality of light-emitting elements and the reflective material-containing portion or the phosphor-containing portions is/are adhered to the side surfaces of the plurality of light-emitting elements, and curing the resin sheet and then cutting the substrate and the resin sheet to singulate individual light-emitting devices.


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