The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Apr. 29, 2015
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Bradley E Williams, Cary, NC (US);

Kevin W Haberern, Cary, NC (US);

Bennett D Langsdorf, Cary, NC (US);

Manuel L Breva, Morrisville, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 25/075 (2006.01); H01L 33/40 (2010.01); H01L 33/46 (2010.01); H01L 33/08 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 25/0753 (2013.01); H01L 27/15 (2013.01); H01L 27/156 (2013.01); H01L 33/08 (2013.01); H01L 33/382 (2013.01); H01L 33/405 (2013.01); H01L 33/46 (2013.01); H01L 33/62 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32257 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Monolithic LED chips are disclosed comprising a plurality of active regions on a submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another to minimize the visibility of the space during operation. The LED chips can also comprise layers structures and compositions that allow improved reliability under high current operation.


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